虹冠電 3257.TW Dividend Analysis

TW StockSemiconductor
(No presentation for 3257)

3257

虹冠電

55.80D

2.20%

(1.20)

3257 Dividend Score

3

24

15

Not for Holding
  • AI analysis rates 3257 with a lower dividend score of 2.0.
  • The current dividend yield of 3257 is 4.11%.
  • Due to its low dividend yield, 3257 may not be suitable as a long-term investment for dividend-focused investors.
  • When the dividend rating was 2, the average dividend fill ratio was 89.71%, the average dividend yield was 2.79%, and the average ex-dividend period was 48.4 days.
  • Compared to similar-rated companies, 3257 has slightly higher dividend fill rate and average dividend yield.

3257 Dividend Reference Factor

The dividend force score is mainly based on the following statistical data and factors such as dividend yield.

Avg. Yield

4.11%

Avg. Volatility

46.01%

Avg. Filling Rate

78.57%

Avg. Filling Days

18.09

Consequent Years

10

Dividend Yield & Volatility

Update to 2025/5/11 (Weekly Update)

3257 Historical Dividend Policy

The following lists the company's past and present dividend policies, and calculates information such as dividend yield and ex-dividend days.

Dividend Distribution and Dividend Yield

2024 Filling Days: 0

$3 (Incl. Stock Dividend $0)

4.3%

2023 Filling Days: 1

$1 (Incl. Stock Dividend $0)

1.88%

2022 Filling Days: 0

$5 (Incl. Stock Dividend $0)

7.44%

2021 Filling Days: 0

$3 (Incl. Stock Dividend $0.1)

3.71%

2020 Filling Days: 4

$2.43 (Incl. Stock Dividend $0.048634)

3.08%

Top 10 High Relevance to 3257 Dividend Score