祥碩 5269.TW Dividend Analysis

TW StockSemiconductor
(No presentation for 5269)

5269

祥碩

1750.00D

-1.96%

(-35.00)

5269 Dividend Score

3

24

15

Unstable Dividend
  • AI analysis rates 5269 with a medium dividend score of 3.0.
  • The current dividend yield of 5269 is 1.72%.
  • Despite the low dividend yield, due to its high dividend fill rate, 5269 remains suitable for a buy-and-hold investment strategy.
  • When the dividend rating was 3, the average dividend fill ratio was 100.00%, the average dividend yield was 1.82%, and the average ex-dividend period was 34.6 days.
  • Compared to similar-rated companies, 5269 has a similar dividend fill rate.

5269 Dividend Reference Factor

The dividend force score is mainly based on the following statistical data and factors such as dividend yield.

Avg. Yield

1.73%

Avg. Volatility

61.68%

Avg. Filling Rate

100%

Avg. Filling Days

11.5

Consequent Years

10

Dividend Yield & Volatility

Update to 2025/5/4 (Weekly Update)

5269 Historical Dividend Policy

The following lists the company's past and present dividend policies, and calculates information such as dividend yield and ex-dividend days.

Dividend Distribution and Dividend Yield

2024 Filling Days: 1

$18.58 (Incl. Stock Dividend $0)

1.13%

2023 Filling Days: 2

$20 (Incl. Stock Dividend $0)

2.08%

2022 Filling Days: 1

$26 (Incl. Stock Dividend $0)

2.78%

2021 Filling Days: 3

$24 (Incl. Stock Dividend $0)

1.24%

2020 Filling Days: 1

$11.97 (Incl. Stock Dividend $0)

0.68%

Top 10 High Relevance to 5269 Dividend Score