光罩 2338.TW Dividend Analysis

TW StockSemiconductor
(No presentation for 2338)

2338

光罩

29.55D

-0.34%

(-0.10)

2338 Dividend Score

3

24

15

Not for Holding
  • AI analysis rates 2338 with a lower dividend score of 2.0.
  • The current dividend yield of 2338 is 2.36%.
  • Due to its low dividend yield and unstable dividend policy, 2338 may not be suitable as a long-term investment for dividend-focused investors.
  • When the dividend rating was 2, the average dividend fill ratio was 71.64%, the average dividend yield was 3.56%, and the average ex-dividend period was 47.3 days.
  • Compared to similar-rated companies, 2338 has a similar average dividend yield over the past 5 years.

2338 Dividend Reference Factor

The dividend force score is mainly based on the following statistical data and factors such as dividend yield.

Avg. Yield

2.36%

Avg. Volatility

42.72%

Avg. Filling Rate

74.07%

Avg. Filling Days

33.3

Consequent Years

0

Dividend Yield & Volatility

Update to 2025/5/4 (Weekly Update)

2338 Historical Dividend Policy

The following lists the company's past and present dividend policies, and calculates information such as dividend yield and ex-dividend days.

Dividend Distribution and Dividend Yield

2024 Filling Days: 0

$0 (Incl. Stock Dividend $0)

0%

2023 Filling Days: 8

$2.5 (Incl. Stock Dividend $0)

3.26%

2022 Filling Days: 3

$2 (Incl. Stock Dividend $0)

2.63%

2021 Filling Days: 1

$1.5 (Incl. Stock Dividend $0)

1.36%

2020 Filling Days: 1

$1 (Incl. Stock Dividend $0)

3.58%

Top 10 High Relevance to 2338 Dividend Score