研通 6229.TW Dividend Analysis

TW StockSemiconductor
(No presentation for 6229)

6229 Dividend Score

3

24

15

Suitable for Holding
  • AI analysis rates 6229 with a higher dividend score of 4.0.
  • The current dividend yield of 6229 is 4.53%.
  • Due to its consistent long-term dividend payments, 6229 is suitable for a buy-and-hold investment strategy.
  • When the dividend rating was 4, the average dividend fill ratio was 86.16%, the average dividend yield was 4.78%, and the average ex-dividend period was 57.1 days.
  • Compared to similar-rated companies, 6229 has a similar dividend fill rate.

6229 Dividend Reference Factor

The dividend force score is mainly based on the following statistical data and factors such as dividend yield.

Avg. Yield

4.53%

Avg. Volatility

48.53%

Avg. Filling Rate

81.82%

Avg. Filling Days

46.11

Consequent Years

10

Dividend Yield & Volatility

Update to 2025/5/4 (Weekly Update)

6229 Historical Dividend Policy

The following lists the company's past and present dividend policies, and calculates information such as dividend yield and ex-dividend days.

Dividend Distribution and Dividend Yield

2024 Filling Days: 0

$0.5 (Incl. Stock Dividend $0)

1.19%

2023 Filling Days: 67

$1.6 (Incl. Stock Dividend $0)

5.78%

2022 Filling Days: 7

$2.5 (Incl. Stock Dividend $0)

10.33%

2021 Filling Days: 0

$1.02 (Incl. Stock Dividend $0)

1.96%

2020 Filling Days: 10

$0.54 (Incl. Stock Dividend $0)

3.61%

Top 10 High Relevance to 6229 Dividend Score