矽格 6257.TW Dividend Analysis

TW StockSemiconductor
(No presentation for 6257)

6257

矽格

72.50D

0.55%

(0.40)

6257 Dividend Score

3

24

15

Suitable for Holding
  • AI analysis rates 6257 with a higher dividend score of 4.0.
  • The current dividend yield of 6257 is 6.40%.
  • Due to its high dividend yield and consistent long-term dividend payments, 6257 is well-suited for a buy-and-hold investment strategy.
  • When the dividend rating was 4, the average dividend fill ratio was 73.08%, the average dividend yield was 6.63%, and the average ex-dividend period was 57.1 days.
  • Compared to similar-rated companies, 6257 has a higher dividend fill rate and a more favorable average dividend yield over the past 5 years.

6257 Dividend Reference Factor

The dividend force score is mainly based on the following statistical data and factors such as dividend yield.

Avg. Yield

6.4%

Avg. Volatility

34.29%

Avg. Filling Rate

77.27%

Avg. Filling Days

42.59

Consequent Years

10

Dividend Yield & Volatility

Update to 2025/4/30 (Weekly Update)

6257 Historical Dividend Policy

The following lists the company's past and present dividend policies, and calculates information such as dividend yield and ex-dividend days.

Dividend Distribution and Dividend Yield

2024 Filling Days: 2

$2.6 (Incl. Stock Dividend $0)

3.43%

2023 Filling Days: 20

$4.2 (Incl. Stock Dividend $0)

7.95%

2022 Filling Days: 5

$4.13 (Incl. Stock Dividend $0)

8.89%

2021 Filling Days: 13

$2.87 (Incl. Stock Dividend $0)

4.58%

2020 Filling Days: 93

$2.2 (Incl. Stock Dividend $0)

4.97%

Top 10 High Relevance to 6257 Dividend Score